By Topic

Recent progress and remaining challenges in pattern transfer technologies for advanced chip designs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Summary form only given. Even as Moore's law continues to drive "tiny technologies" through relentless scaling, the main technology driver for semiconductor chips has evolved from DRAMs to microprocessors to FPGAs. The underlying metrics have evolved from bits per chip and cost per bit for computers to functions per chip and cost per function for consumer products. The talk reviews the remarkable progress that has been made in enabling pattern transfer technologies, including mask design, lithography enhancements and precision etching, on the new 300 mm wafers for an increasingly wide variety of new materials. However, there is a cost associated with all this and the cost-benefit tradeoffs will almost certainly drive new inflections in the entire food chain, which the author tries to identify.

Published in:

Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on

Date of Conference:

21-23 March 2005