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Modeling of 3D packages using EM simulators

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4 Author(s)
Kelander, I. ; Nokia Corp., Helsinki, Finland ; Arslan, A.N. ; Hyvonen, L. ; Kangasmaa, Seppo

This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.

Published in:

Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on

Date of Conference:

9-12 May 2004