By Topic

Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Farcy, A. ; STMicroelectronics, Crolles, France ; Cueto, O. ; Blampey, B. ; Lacrevaz, T.
more authors

The speed of integrated circuits is increasingly fixed by interconnect performances. To address this issue, the development of new back-end of line technology schemes and materials should be driven by predictions of associated benefits. A new tool was developed and coupled to electromagnetic software to carry out time domain simulations. As a result, the dependences of interconnect performances on process parameters and design rules were extracted for the 65 nm and 45 nm technology nodes.

Published in:

Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on

Date of Conference:

9-12 May 2004