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Low temperature cofired ceramic (LTCC) substrates provide a low-cost packaging approach for radio frequency (RF) integrated circuits. Thermally-driven curvature development in these LTCC tapes and laminates, which can introduce property-limiting defects into a device, was examined quantitatively using an optical profilometer. Contrary to the standard perception of tape cast products, these specimens consistently experienced the largest increases in curvature during burnout rather than during sintering. Sintering actually leads to dramatic decreases in curvature. Slight anisotropic changes in curvature were observed when comparing those directions parallel and perpendicular to the tape casting direction. In the laminates, individual layer orientations had strong effects on overall curvature. Springback after the application of lamination pressure strongly contributes to curvature. "Microslumping" at the ends of the tapes/laminates occurred during sintering and could be accounted for via discrete element models of sintering. The latter phenomenon can be eliminated by controlling relative tape orientation.