Skip to Main Content
An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given. Key parameters affecting micro cooler performance are described. A 3-μm thick 200× (3 nm Si/12 nm Si0.75Ge0.25) superlattice device can achieve maximum cooling of 4°C at room temperature, maximum cooling power density of 600 W/cm2 for 40-μm diameter device and fast transient response on the order of tens of micro-seconds independent of the device size. Three-dimensional electrothermal simulations show that individual microrefrigerators could be used to remove hot spots in silicon chips with minimal increase in the overall power dissipation.
Components and Packaging Technologies, IEEE Transactions on (Volume:28 , Issue: 1 )
Date of Publication: March 2005