By Topic

On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Shakouri, Ali ; Baskin Sch. of Eng., Univ. of California, Santa Cruz, CA, USA ; Yan Zhang

An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given. Key parameters affecting micro cooler performance are described. A 3-μm thick 200× (3 nm Si/12 nm Si0.75Ge0.25) superlattice device can achieve maximum cooling of 4°C at room temperature, maximum cooling power density of 600 W/cm2 for 40-μm diameter device and fast transient response on the order of tens of micro-seconds independent of the device size. Three-dimensional electrothermal simulations show that individual microrefrigerators could be used to remove hot spots in silicon chips with minimal increase in the overall power dissipation.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:28 ,  Issue: 1 )