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An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given. Key parameters affecting micro cooler performance are described. A 3-μm thick 200× (3 nm Si/12 nm Si0.75Ge0.25) superlattice device can achieve maximum cooling of 4°C at room temperature, maximum cooling power density of 600 W/cm2 for 40-μm diameter device and fast transient response on the order of tens of micro-seconds independent of the device size. Three-dimensional electrothermal simulations show that individual microrefrigerators could be used to remove hot spots in silicon chips with minimal increase in the overall power dissipation.