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We provide two new equivalent global models - equivalent solder joint model and equivalent layer model - to perform the simulation of solder joints under drop impact. A detailed global model with a fine mesh is used as a benchmark to control the accuracy of the simplified equivalent model. Excellent correlation has been achieved in these two models, when compared with the detailed global model. It is shown that by using these new models, the model size and computational processing time have been greatly reduced, while the accuracy of the results is still maintained. An electronic package with 10,000 interconnects undergoing drop impact was studied. We also apply the same approach for the simulation of packaging with underfill undergoing board level drop test.
Date of Conference: 8-10 Dec. 2004