By Topic

Effect of hygrothermal aging on interfacial reliability of flip chip on board (FCOB) assembly

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Y. L. Zhang ; Sch. of MPE, Nanyang Technol. Univ., Singapore, Singapore ; X. Q. Shi ; W. Zhou

The moisture migrating into underfill decreases the adhesion strength, swells to deform the assembly, and weakens underfill mechanical and thermal properties. In this study, interfacial reliability of FCOB exposed at 85 degC/85%RH was studied using Moire interferometry and mu-DiSC system developed. A thermal aging study was simultaneously performed to understand the time effect on long duration of hygrothermal aging. The results showed that the thermal aging relieved the stresses induced by hygrothermal swelling mismatch between dissimilar materials involved, which indicated the time effect is not negligible in the moisture conditioning. Subsequently, a mu-DiSC technique was applied to measure critical interfacial fracture toughness of Si/UF interface. It is shown that moisture could reduce the interfacial strength significantly due to the breaking of hydrogen bonding. Finally, the morphologies of fracture were studied under the SEM

Published in:

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Date of Conference:

8-10 Dec. 2004