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Bond-and-transfer scanning probe array for high-density data storage

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5 Author(s)
Hsieh, G.-W. ; Ind. Technol. & Res. Inst., Hsinchu, Taiwan ; Ching-Hsiang Tsai ; We-Chih Lin ; Chao-Chiun Liang
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This paper reports a study of a wafer-level bond-and-transfer technique for scanning probe arrays and its future application on probe-based data storage. The bonding performance between sodium ion-rich glass and silicon-nitride-deposited silicon substrate has been characterized. The effects of tool pressure, bonding time, surface properties, and cleanliness were thoroughly discussed. Furthermore, the silicon-nitride-based scanning probe array with pyramidal tip and 1.5-μm-thick cantilevers were successful bonded and transferred to Pyrex 7740 substrate by the optimized condition of wafer-scale electrostatic force bonding and transferring processes. The nano-patterning capabilities of scanning probe array for high-density data storage were also discussed.

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Magnetics, IEEE Transactions on  (Volume:41 ,  Issue: 2 )