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High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging

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6 Author(s)
Polyakov, A. ; Lab. of High-Frequency Technol. & Components, Delft Inst. of Microelectron. & Submicrontechnology, Netherlands ; Sinaga, S. ; Mendes, P.M. ; Bartek, M.
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High-resistivity polycrystalline silicon (HRPS) is presented as a novel low-cost and low-loss substrate for radio-frequency (RF) passive components in wafer-level packaging and integrated passive networks. A record quality factor (Q=11; 1 GHz; 34 nH) and very low loss (0.65 dB/cm; 17 GHz) are demonstrated for inductors and coplanar waveguides, respectively, on HRPS.

Published in:

Electronics Letters  (Volume:41 ,  Issue: 2 )