By Topic

Test chip and infrastructure IP solutions to improve the back-end process during all phases from a new technology development to manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Forli, L. ; L2MP-Polytech, UMR CNRS, Marseille, France ; Portal, J.M. ; Nee, D. ; Borot, B.

This paper presents a test chip and infrastructure IP (I-IP) solutions to accelerate process development of interconnects on new advanced technology and to improve the back-end-of-line (BEOL) yield on products. The test chip and the I-IP use the same architecture which is described in using a bottom-up approach with emphasis on its scalability. Using this test chip, the specifications of process back-end critical parameters can be quickly and easily analyzed. Using the dedicated infrastructure IP, the defect density tracking as well as the test and diagnosis of process back-end critical parameters can be rapidly and simply performed. To reach this goal, the test flow and its related signature extraction are given. Moreover, each extracted signature is merged in a database which are used to diagnose defected back-end parameters in the I-IP. Thus, the use of the test chip and the I-IP allows us to improve the manufacturing process from the beginning of a new technology development and integration to the end of ramp-up production and product manufacturing.

Published in:

Devices, Circuits and Systems, 2004. Proceedings of the Fifth IEEE International Caracas Conference on  (Volume:1 )

Date of Conference:

3-5 Nov. 2004