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A low cost compact (3 mm × 3 mm) internally matched CDMA/WCDMA power amplifier module is designed with high-density-interconnection (HDI) laminate technology. Design methodologies for the power amplifier module are presented. Some advances in wafer processing technology are discussed. The PCS/IMT dual band WCDMA power amplifier achieves a typical 40% power-added-efficiency (PAE) at 27.5 dBm along with a -40 dBc linearity at 5 MHz offset frequency. At a low operating power of 16 dBm, 22% PAE can be achieved at Vcc = 1.5 V. Manufacturing yield issues are discussed as well.