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Design and development of compact CDMA/WCDMA power amplifier module for high yield low cost manufacturing

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14 Author(s)
Xu, S. ; Anadigics, Inc., Warren, NJ, USA ; Frey, D. ; Chen, T. ; Prejs, A.
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A low cost compact (3 mm × 3 mm) internally matched CDMA/WCDMA power amplifier module is designed with high-density-interconnection (HDI) laminate technology. Design methodologies for the power amplifier module are presented. Some advances in wafer processing technology are discussed. The PCS/IMT dual band WCDMA power amplifier achieves a typical 40% power-added-efficiency (PAE) at 27.5 dBm along with a -40 dBc linearity at 5 MHz offset frequency. At a low operating power of 16 dBm, 22% PAE can be achieved at Vcc = 1.5 V. Manufacturing yield issues are discussed as well.

Published in:

Compound Semiconductor Integrated Circuit Symposium, 2004. IEEE

Date of Conference:

24-27 Oct. 2004