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Fuse regrowth kinetics

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3 Author(s)
D. Lambert ; Adv. Micro Devices Inc., Sunnyvale, CA, USA ; R. Gannamani ; R. C. Blish

The kinetics of fuse regrowth during temperature humidity bias (THB) stresses were modeled with a power law for relative humidity (exponent ∼2.3) and a power law for bias voltage (exponent ∼1.7). Using these results we determined the optimal laser cut parameters to maximize product reliability.

Published in:

IEEE Transactions on Device and Materials Reliability  (Volume:4 ,  Issue: 4 )