By Topic

Reliability of pressure-sensitive adhesive tapes for heat sink attachment in air-cooled electronic assemblies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
V. Eveloy ; CALCE Electron. Products & Syst. Center, Univ. of Maryland, College Park, MD, USA ; P. Rodgers ; M. G. Pecht

This study investigates the reliability of commercially available pressure-sensitive adhesive (PSA) tapes used for electronic component-to-heat sink attachment. It is found that creep can affect the PSA reliability. Therefore, creep is experimentally characterized using isothermal, constant load, double lap shear measurements in conditions representative of vertically oriented heat sink applications. PSA joint life predictions are derived from the accelerated creep characteristics using a secondary creep model. The creep resistance of a laminated silicone/aluminum/acrylic PSA tape is found to be significantly lower than that of a single-layer acrylic tape. This suggests that the potential impact of tape creep on joint reliability should be carefully evaluated as a function of tape chemistry/construction and application environment. Furthermore, the sensitivity of PSA creep characteristics to both operating temperature and heat sink weight highlights the need for thermally optimized, least-weight heat sink designs.

Published in:

IEEE Transactions on Device and Materials Reliability  (Volume:4 ,  Issue: 4 )