By Topic

Addendum: Modular heat sinks for desktop computers and other electronics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
J. W. Klett ; Metals & Ceramics Div., Oak Ridge Nat. Lab., TN, USA ; M. Trammell

The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks.

Published in:

IEEE Transactions on Device and Materials Reliability  (Volume:4 ,  Issue: 4 )