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Random and systematic defect analysis using IDDQ signature analysis for understanding fails and guiding test decisions

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2 Author(s)

This work demonstrates IDDQ signature analysis of random and systematic defects, including yield detractors and reliability defects. Application is demonstrated for both understanding failure root cause and guiding test decisions. IDDQ signatures contain rich information about the circuit, defect behavior and processing conditions. This paper describes capturing that information by classifying signatures into different categories and using the classifications to learn about the nature of the defects occuring on a variety of ASIC chips.

Published in:

Test Conference, 2004. Proceedings. ITC 2004. International

Date of Conference:

26-28 Oct. 2004