By Topic

Solving an inverse partial differential equation for a two dimensional heat conduction problem with oscillating boundary conditions using an artificial immune system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Karr, C.L. ; The University of Alabama ; Banerjee, A. ; Mishra, P.

Increases in computing power have brought a renewed interest in solving inverse initial-value, boundary-value (inverse IVBV) problems, and in the development of robust, computationally efficient methods suitable for their solution. Inverse IVBV problems are prominent in science and engineering problems governed by partial differential equations where often an effect is measured and the cause is not known. In these situations scientists and engineers typically observe the response of a system and desire to know the particulars of the system that elicited such a response. In this paper, an artificial immune system (AIS) is used to monitor a physical system, to identify the need for solving an inverse IVBV problem within that system, and to solve said problem. Specifically, an AIS is used to determine the heat conducting properties of a material that elicits a measured temperature distribution response when subjected to time-varying boundary temperatures. Results indicate that the AIS provides an effective mechanism for solving this particular inverse IVBV problem.

Published in:

Machine Learning and Applications, 2004. Proceedings. 2004 International Conference on

Date of Conference:

16-18 Dec. 2004