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In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several cooling conditions was also made and presented in the paper.
Date of Conference: 28-28 Feb. 2004