Cart (Loading....) | Create Account
Close category search window
 

CoTiO3 high-κ dielectrics on HSG for DRAM applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Tien-Sheng Chao ; Dept. of Electrophys., Nat. Chiao-Tung Univ., Hsinchu, Taiwan ; Wei-Ming Ku ; Hong-Chin Lin ; Landheer, D.
more authors

In this paper, a new high-κ dielectric CoTiO3 has been investigated for the first time on hemispherical grained (HSG) poly-Si dynamic random access memories capacitors. Three types of HSG were prepared. We found that capacitors with maximum grain size and the highest density exhibit twice the capacitance of the others. The dielectric constant for CoTiO3 was estimated to be larger than 50. Leakage current measurements performed at temperatures as high as 100°C show that this dielectric is stable. The polarity dependence is found to be due to the different barrier heights with the nitride barrier. A leakage mechanism is proposed for this polarity dependence.

Published in:

Electron Devices, IEEE Transactions on  (Volume:51 ,  Issue: 12 )

Date of Publication:

Dec. 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.