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An ultralow inductance I/O interconnect, called a coaxial polymer pillar (CoPP) is introduced that is compatible with sea of polymer pillars (SoPP) recently presented. Polymer pillars are highly process-integrated and mechanically flexible (compliant) electrical-optical I/O interconnections that mitigate thermomechanical expansion mismatches. The 100x smaller parasitic inductance of the CoPP (in the range of 0.1 pH) compared to the inductance of a solder bump or a regular polymer pillar makes it an excellent I/O interconnect technology for power distribution. The density of CoPPs may exceed 105/cm2.