Notification:
We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Chu, K.-M. ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Choi, J.-H. ; Lee, J.-S. ; Cho, H.S.
more authors

The effect of silver coating on pure indium bumps for low temperature and high speed flip-chip applications is presented with respect to optoelectronic and microwave characteristics. The current-voltage and light power-current characteristics of flip-chip bonded vertical-cavity surface-emitting laser (VCSEL) arrays are improved by coating a thin silver layer of 0.2 /spl mu/m. The flip-chip assembled coplanar waveguide packages using silver coated bumps show the insertion loss is about 3.3 dB/cm at 20 GHz and the return loss is under 13 dB.

Published in:

Electronics Letters  (Volume:40 ,  Issue: 23 )