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Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

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7 Author(s)
Chu, K.-M. ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Choi, J.-H. ; Lee, J.-S. ; Cho, H.S.
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The effect of silver coating on pure indium bumps for low temperature and high speed flip-chip applications is presented with respect to optoelectronic and microwave characteristics. The current-voltage and light power-current characteristics of flip-chip bonded vertical-cavity surface-emitting laser (VCSEL) arrays are improved by coating a thin silver layer of 0.2 /spl mu/m. The flip-chip assembled coplanar waveguide packages using silver coated bumps show the insertion loss is about 3.3 dB/cm at 20 GHz and the return loss is under 13 dB.

Published in:

Electronics Letters  (Volume:40 ,  Issue: 23 )