Metallized 3D foam technology: a well-suited solution for high performance, low-cost, CM-wave and MM-wave system integration

The future emergence of high performance, low-cost microwave systems requires the development of well-suited technological solutions. A simple one is based on the use of a very common foam material, in combination with, on one hand, accurate 3D modeling techniques and, on the other hand, suitable metallization solutions, resulting in cost-effective high volume production abilities. By applying this foam technology, a wide range of microwave engineering issues can be successfully solved, both at centimeter-wave and millimeter-wave frequency bands. In this paper, the basics of the metallized 3D foam technology will be first described. Then, a primary experimental validation of this technology will be demonstrated by the fabrication of a few conventional devices, integrated in planar or wave-guide technologies. Finally, several added value microwave structures will be presented to illustrate the high flexibility and the multiple advantages offered by this integration approach, for a wide range of applications (at frequency up to 80 GHz).