Cart (Loading....) | Create Account
Close category search window
 

Comparison between epi-down and epi-up bonded high-power single-mode 980-nm semiconductor lasers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)

Epi-down and epi-up bonded high-power single-mode 980-nm lasers have been studied in terms of bonding process, thermal behavior, optical performances, and long-term laser reliability. We demonstrated that epi-down bonding can offer lower thermal resistance and improved optical performance without degrading the long-term laser reliability. An optical power of 630 mW was obtained for the first time from an epi-down bonded 980-nm pump module. Our studies have shown that epi-down bonding of single-mode 980-nm lasers can reduce junction temperature and thermal resistance by up to 30%. Experimental measurements showed over 20% in thermal rollover power improvement and over 25% reduction in wavelength shift versus current in epi-down mounted lasers compared to epi-up mounted lasers. Lifetime test over 14 000 h at 500 mA and 80°C of the epi-down bonded lasers is reported for the first time.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 4 )

Date of Publication:

Nov. 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.