By Topic

Issues in validation of complex-valued simulations for signal integrity analysis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Duffy, A. ; Sch. of Eng. & Technol., De Montfort Univ., Leicester, UK ; Martin, A. ; Antonini, G. ; Scogna, A.C.
more authors

Signal integrity is concerned with such design issues as signal distortions caused by the effects of unmatched impedances, designed-in or parasitic capacitance/inductance and current return paths. It is of increasing importance because of the widespread use of high-speed digital circuitry and it is, therefore, a natural ally to EMC engineering. Circuit simulators, such as SPICE are widely used to analyze circuit performance, with significant success. More interest is being generated in mixed circuit/field models and full wave simulators in order to extend the applicability of signal integrity investigations. Like more established EMC studies, the validation of numerical models for this purpose is an issue to be addressed. This is particularly important, as the models may be required to compare complex valued data as opposed to only magnitude (or single valued data) as in the case of electric network characterization or equivalent circuit extraction. This paper considers how the feature selective validation (FSV) scheme can be applied to quantifying complex valued data.

Published in:

Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on  (Volume:3 )

Date of Conference:

9-13 Aug. 2004