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Wide-band finite ground coplanar (FGC) interconnects for on-chip packaging of RF MEMS switches used in smart antennas and phased arrays

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2 Author(s)
M. A. Morton ; Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; J. Papapolymerou

A wide-band finite ground coplanar (FGC) interconnect is presented for use in thermal compression bonded packages for RF MEMS devices that are used for the development of smart antennas and electronically steered phased arrays at up to 50 GHz. The fabrication process is compatible with standard IC fabrication techniques, and allows for simple, high-performance, and cost-effective on-chip packaging of such devices on the same substrate as the antenna elements. The measured attenuation is approximately 0.25 dB per interconnect, and is relatively constant from 2 to 50 GHz.

Published in:

IEEE Antennas and Wireless Propagation Letters  (Volume:3 ,  Issue: 1 )