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High breakdown Voltage undoped AlGaN-GaN power HEMT on sapphire substrate and its demonstration for DC-DC converter application

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6 Author(s)
Saito, W. ; Semicond. Co., Toshiba Corp., Kawasaki, Japan ; Kuraguchi, M. ; Takada, Y. ; Tsuda, K.
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Undoped AlGaN-GaN power high electron mobility transistors (HEMTs) on sapphire substrate with 470-V breakdown voltage were fabricated and demonstrated as a main switching device for a high-voltage dc-dc converter. The fabricated power HEMT realized a high breakdown voltage with a field plate structure and a low on-state resistance of 3.9 mΩ·cm2, which is 10 × lower than that of conventional Si MOSFETs. The dc-dc converter operation of a down chopper circuit was demonstrated using the fabricated device at the input voltage of 300 V. These results show the promising possibilities of the AlGaN-GaN power HEMTs on sapphire substrate for future switching power devices.

Published in:
Electron Devices, IEEE Transactions on  (Volume:51 ,  Issue: 11 )

Date of Publication: Nov. 2004

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