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This paper discusses the image analysis and data processing for thermal deformation measurement of PCBs. A specially designed test bench was employed successfully to measure the deformation of PCB using moire interferometry. The discussions on optical methods, experimental procedure and image data processing is presented. Fourier-based and wavelet-based approaches are discussed for potential automatic processing. All image and data analysis were finished by MATLAB.
Date of Conference: 30 June-3 July 2004