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Image analysis and data processing of time series fringe pattern of PCBs by using moire interferometry

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3 Author(s)
Lei Han ; Central South Univ., Changsha, China ; Jue Zhong ; Voloshin, A.

This paper discusses the image analysis and data processing for thermal deformation measurement of PCBs. A specially designed test bench was employed successfully to measure the deformation of PCB using moire interferometry. The discussions on optical methods, experimental procedure and image data processing is presented. Fourier-based and wavelet-based approaches are discussed for potential automatic processing. All image and data analysis were finished by MATLAB.

Published in:
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Date of Conference: 30 June-3 July 2004

Page(s):
141 - 145
Print ISBN:
0-7803-8620-5
INSPEC Accession Number:
8109408
Digital Object Identifier :
10.1109/HPD.2004.1346687
Product Type:
Conference Publications

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