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In this abstract we present a highly manufacturable, high performance 90nm technology with best in class performance for 35nm gate-length N and P transistors. Unique, but simple and low cost, process changes have been utilized to modulate channel stress and implant profile to generate enhanced performance with no additional masks. High drive currents of 1193uA/um and 587uA/um are obtained for nMOS and pMOS transistors respectively at 1.2V Vdd and an Ioff of 60nA/μm. An industry leading 90nm technology CV/I of 0.61 ps and 1.12ps are obtained for nMOS and pMOS transistors respectively. An aggressively scaled 12Å EOT plasma-nitrided, cluster gate dielectric is used. Process conditions are optimized to obtain high drive current, good Vt roll-off control and simultaneously meet reliability requirements.