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Three-dimensional circuit integration based on self-synchronized RF-interconnect using capacitive coupling

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5 Author(s)
Qun Gu ; Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA ; Xu, Z. ; Jongsun Kim ; Jenwei Ko
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A self-synchronized RF-interconnect (SSRFI), based on capacitive coupling and peak signal detection, is presented. In this SSRFI, small coupling capacitor (60fF) is used to interconnect vertical active layers in 3-Dimensional IC. The demonstrated SSRFI system, including both transmitter and receiver, has been designed, fabricated and verified in UMC 0.18 μm CMOS with a PRBS data rate of 3Gbit/s, a BER of 1.2×10-10 and a rms jitter of 1.28ps. The core circuit burns 4mW from a 1.8V supply and occupies 0.02mm2 chip area.

Published in:

VLSI Technology, 2004. Digest of Technical Papers. 2004 Symposium on

Date of Conference:

15-17 June 2004