Cart (Loading....) | Create Account
Close category search window
 

Analytical solutions for thermal stresses in buried channel waveguides

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Huang, M. ; Dept. of Mech. & Aerosp. Eng., Princeton Univ., NJ, USA

Thermal stresses are important factors in determining the birefringence of optical waveguides. Analytical solutions are developed to estimate the thermal stresses in the core of a buried rectangular channel waveguide. The closed-form solutions for various situations are obtained. The results show that the thermal expansion mismatch between the upper cladding and substrate plays significant role in determining the anisotropy of the thermal stresses in the core. The analytical solutions developed in this paper are consistent with finite element simulations and experimental results.

Published in:

Quantum Electronics, IEEE Journal of  (Volume:40 ,  Issue: 11 )

Date of Publication:

Nov. 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.