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Integrated circuit ceramic ball grid array package antenna

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1 Author(s)
Y. P. Zhang ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit package antenna (ICPA) for highly integrated RF transceivers. A compact ICPA of this type has, for the first time, been designed and fabricated in a ceramic ball grid array (CBGA) package format. The novel ICPA, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured antenna performance of the ICPA is presented. The effects of the different physical parts of the ICPA on the antenna performance are investigated. Results show that the ICPA achieved impedance bandwidth of 4.1% and radiation efficiency of 72%, and gain of 4.8 dBi at 5.715 GHz.

Published in:

IEEE Transactions on Antennas and Propagation  (Volume:52 ,  Issue: 10 )