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Via etching through extremely thick organic dielectrics

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1 Author(s)
Zeafla, L.L. ; SAIC, Hanover, MD, USA

A process for etching vias in extremely thick (85 to 152 μm) HD MicroSystems polyimide PI2611 was developed using commercial reactive ion etching tools. Sloped via profiles were obtained using a combination of hard masks made of aluminum and silicon dioxide thin films, combined with reactive ion etch steps in pure O2 and O2/CF4. The deep via profiles provided good step coverage. These vias, coated with a 3-μm-thick copper film, produced satisfactory electrical continuity between layers of package interconnects. The process is reproducible, reliable, and, hence, practically useful for fabricating a small number of parts in spite of extended etch periods.

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Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 3 )