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Multiscale free-space optical interconnects for intrachip global communications

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3 Author(s)
M. J. McFadden ; Dept. of Electr. & Comput. Eng., Delaware Univ., USA ; M. Iqbal ; M. W. Haney

Optical intrachip global interconnects are discussed. Methods for replacing metal global interconnects with free-space optical interconnects are compared analytically to highlight the bandwidth capacity benefits of using a multiscale optical system for intrachip global communications.

Published in:

Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS Summer Topical Meetings

Date of Conference:

28-30 June 2004