By Topic

Silicon-germanium BiCMOS HBT technology for wireless power amplifier applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

11 Author(s)
Johnson, J.B. ; IBM Corp., Essex Junction, VT, USA ; Joseph, A.J. ; Sheridan, D.C. ; Maladi, R.M.
more authors

This paper discusses and illustrates the key device design issues for SiGe BiCMOS HBTs suitable for wireless power amplifier (PA) applications. Experimental results addressing ruggedness, ac performance, and safe operating area for high-breakdown SiGe HBTs built in several generations of BiCMOS technology are presented. Implications of recent high-performance SiGe HBT scaling achievements for BiCMOS technologies targeting wireless PA applications are considered. Circuit results for GSM, PCS, GPRS, and EDGE front-end modules have been obtained. A one-chip solution is demonstrated, including control circuitry and switching functionality, that supports all GPRS, PCS, and EDGE modes featuring output power at 33.8 dBm and overall power added efficiency of 37% withstanding voltage standing wave ratio conditions of 15:1.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:39 ,  Issue: 10 )