Cart (Loading....) | Create Account
Close category search window
 

Growth of an Au layer with a thickness in the order of 10 nm on a Yb-Ba-Cu-O substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Takahashi, K. ; Sanyo Electr. Co. Ltd., Osaka, Japan ; Shimaoka, K. ; Kamino, M. ; Yoshisato, Y.
more authors

A Yb-Ba-Cu-O/Au structure for an S/N/S (superconductor/normal metal/superconductor) Josephson junction has been successfully fabricated using the bulk Yb-Ba-Cu-O substrate processed by the recently developed PMQ (plasma-arc melting and rapid quenching) method. The coverage of Au layers with a thickness of 30 nm at a substrate temperature of 600°C was confirmed to be almost 100% without any pinholes, which is thin enough to make use of the proximity effect. Similar experiments using Bi2Sr2CaCu2O x single crystals indicated the possibility of high coverage at even lower substrate temperatures

Published in:

Magnetics, IEEE Transactions on  (Volume:27 ,  Issue: 2 )

Date of Publication:

Mar 1991

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.