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SoC integration challenges for a power management/analog baseband IC for 3G wireless chipsets

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4 Author(s)
Evans ; Wireless Analog Technol. Center, Texas Instrum. Inc., Dallas, TX, USA ; McConnell ; Kawamura ; Krug

An integrated power management/analog baseband integrated circuit has been developed in 0.35 /spl mu/m CMOS technology. The IC features multiple low-dropout (LDO) linear voltage regulators, power switches, DC/DC switching converters, a voice band CODEC, and WCDMA and GSM baseband converters all sharing the same substrate. This paper examines the design challenges associated with power management and analog baseband system on a chip (SoC) integration. Optimal floorplanning, power device isolation, shielding, power distribution, reference generation, and noise reduction strategies and techniques are discussed.

Published in:

Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on

Date of Conference:

24-27 May 2004