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Chip-to-chip optoelectronics SOP on organic boards or packages

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9 Author(s)
Gee-Kung Chang ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Guidotti, D. ; Fuhan Liu ; Yin-Jung Chang
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In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:27 ,  Issue: 2 )

Date of Publication:

May 2004

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