Cart (Loading....) | Create Account
Close category search window

Development of winged microscanners: architecture and performance

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Dong Yan ; Sch. of Electr. & Comput. Sci. Eng., Cornell Univ., Ithaca, NY, USA ; Bai Xu ; Castracane, J.

Two-dimensional scanners have a variety of applications in displays, barcode readers, optical data storage devices, and free-space optical interconnects. In this paper, the modeling, simulation, fabrication, and testing of a MEMS-based winged microscanner are described. The microscanner is controlled using electrostatic force distributed across multiple electrodes. Compared to previous cantilever designs, the symmetric spring on the beam is adapted to reduce the spring constant of the suspension beam and increase flexibility. In addition, wings are added to further reduce the actuation voltage. A thorough finite element analysis (both static and dynamic) has been completed to study key design parameters such as driving voltage, operating frequencies, and tilt angle. The focus of this work was on the performance analysis of the microscanner, including squeeze film damping effects. Prototype microscanners and four different microscanner arrays were fabricated using the MUMPS process (MEMSCAP). The dynamic performance of the microscanner was then investigated. For a single electrode actuation, the pull-in voltage of the winged microscanner is as low as 4 V, and it is further reduced to 3 V with only two driving electrodes used to actuate the microscanner, which makes it compatible with off-the-shelf control logic circuits. The initial testing results demonstrated that the maximum tilt angle is approximately 2.5°. To increase this tilt angle, a customized process is now being developed.

Published in:

Sensors Journal, IEEE  (Volume:4 ,  Issue: 5 )

Date of Publication:

Oct. 2004

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.