By Topic

Planar spiral inductors with multilayer micrometer-scale laminated cores for compact-packaging power converter applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Jin-Woo Park ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; F. Cros ; M. G. Allen

Ultralow (0.4 mm) profile spiral inductors with multilayer micrometer-scale NiFe laminated cores were developed for compact-packaging power applications. A simple sacrificial Cu etching process was used to realize seven layers of 1.8-μm-thick laminations, forming the magnetic cores. The laminated cores were combined with a spiral coil to fabricate the spiral inductor in a hybrid fashion. The dimension of a complete device is 40 × 15 mm. In situ electrical characterization verified compatibility with compact-packaging applications. The inductor was implemented in a boost converter (5-10 V) operating at 2.2 MHz, which demonstrated 2-W output with overall efficiency exceeding 70%.

Published in:

IEEE Transactions on Magnetics  (Volume:40 ,  Issue: 4 )