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High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications

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6 Author(s)
Chen, K.J. ; Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China ; Kwok Wai Chan ; Wong, M.K.W. ; Fok, N.M.K.
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We report the first demonstration of high-Q embedded inductors fabricated using a thin-array-plastic-packaging (TAPP) technology. The TAPP technology provides a platform that integrates digital, analog, RF integrated circuits, along with high-performance passive components for system-in-package implementation. Embedded inductors ranging from 14 to 300 nH were fabricated. All the inductors with inductance less than 100 nH exhibit self-resonant frequency above 1 GHz. For a 14-nH inductor, Q factor of 35 was achieved at 1.6 GHz and the self-resonance frequency was measured at 6.15 GHz.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:14 ,  Issue: 9 )