By Topic

3-D electronics interconnect for high-performance imaging detectors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Kwiatkowski, K. ; Phys. Div., Los Alamos Nat. Lab., NM, USA ; Lyke, J. ; Wojnarowski, R. ; Kapusta, C.
more authors

We describe work that extends three-dimensional (3-D) patterned overlay high-density interconnect (HDI) to high-performance imaging applications. The work was motivated by the rigorous requirements of the multiple-pulse imager for dynamic proton radiography. The optical imager has to provide large (>90%) optical fill factor, high quantum efficiency, 200-ns inter-frame time interval, and storage for >32 frames. In order to accommodate the massively parallel electronics including the signal storage for a large number of frames, it is necessary to provide novel 3-D interconnect and packaging architectures. Recently, a 3-D interconnect technology was successfully demonstrated to assemble a stack of 50 signal-processing chips into a cube. Each chip contained test connections (interconnect continuity only) simulating 160 channels of pixel read-out electronics. Test cube assemblies, based on these mock-up integrated circuits, have been fabricated to explore the feasibility of constructing functional cube arrays. A novel 3-D integrated sensor-electronics (mirror-cube) imager architecture is proposed. We also briefly review progress in the custom fast image-processing electronics.

Published in:

Nuclear Science, IEEE Transactions on  (Volume:51 ,  Issue: 4 )