Cart (Loading....) | Create Account
Close category search window

Single photon counting X-ray imaging with Si and CdTe single chip pixel detectors and multichip pixel modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)

Multichip modules (MCM) have been successfully built and operated. These use 4 single-photon counting MPEC 2.3 chips that are bump bonded to 1.3 cm × 1.3 cm CdTe or Si semiconductor pixel sensors. Single-chip detectors were built as well. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bits, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 × 32 pixels of 200 μm × 200 μm pixel size. For a MCM the 4 chips are arranged in a 2 × 2 array which leads to a 64 × 64 sensor pixel geometry. The MCM construction is described, and the imaging performance of the different detectors is shown. A newly developed USB readout system has been used.

Published in:

Nuclear Science, IEEE Transactions on  (Volume:51 ,  Issue: 4 )

Date of Publication:

Aug. 2004

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.