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PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement

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6 Author(s)
Kim, J.-D. ; Semicond. Material R&D Center, Samsung Techwin Co., Ltd., Kyoungki, South Korea ; Choi, W.-S. ; Park, K.-S. ; Kim, E.-H.
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There are many lead-free finish options such as pure Sn, Sn-Ag, Sn-Bi and Sn-Cu post-mold plating and Pd pre-plating for the lead frame plating in semiconductor package. In the present work, Sn-Bi and pure Sn pre-plating technology for alloy 42 lead frame have been performed. The electrodeposition was done by two-tone selective plating method. Ag was plated on external lead, respectively. Surface and cross-sectional morphology were observed by SEM, and solderability/bending crack/whisker performance after temperature cycles have been performed.

Published in:

Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International

Date of Conference:

July 14-16, 2004