Cart (Loading....) | Create Account
Close category search window
 

An improved Reynolds-equation model for gas damping of microbeam motion

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Gallis, Michael A. ; Eng. Sci. Center, Sandia Nat. Labs., Albuquerque, NM, USA ; Torczynski, John R.

An improved gas-damping model for the out-of-plane motion of a near-substrate microbeam is developed based on the Reynolds equation (RE). A boundary condition for the RE is developed that relates the pressure at the beam edge to the beam motion. The coefficients in this boundary condition are determined from Navier-Stokes slip-jump (NSSJ) simulations for small slip lengths (relative to the gap height) and from direct simulation Monte Carlo (DSMC) molecular gas dynamics simulations for larger slip lengths. This boundary condition significantly improves the accuracy of the RE when the microbeam width is only slightly greater than the gap height between the microbeam and the substrate. The improved RE model is applied to microbeams fabricated using the SUMMiT V process.

Published in:

Microelectromechanical Systems, Journal of  (Volume:13 ,  Issue: 4 )

Date of Publication:

Aug. 2004

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.