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This paper shows the potentialities of merging MEMS and micromachining with SiGe technologies in order to speed up the performance of the next generation of front ends, in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented, based on BCB materials and BAW materials. Special attention is paid to ensure full compatibility between IC and MEMS. We have shown that very innovative functions could be considered by using this MEMSIC concept.