Cart (Loading....) | Create Account
Close category search window

Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Bhowmik, H. ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore ; Tou, K.W. ; Tso, C.P.

Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm2 to 0.6 W/cm2. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE

Date of Conference:

9-11 Mar 2004

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.