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Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period

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3 Author(s)
Bhowmik, H. ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore ; Tou, K.W. ; Tso, C.P.

Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm2 to 0.6 W/cm2. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE

Date of Conference:

9-11 Mar 2004

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