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Distance learning (DL) is an instructional delivery system that connects learners with educational resources. In microelectronics and microsystems interconnection and packaging technology, the preparation of electronics engineers for the ever growing requirements is especially a challenge for today's education, and there is an essential need for the application of advanced curricula and teaching methods. In the present paper, the driving forces for the development of curricula and didactic methods are outlined, followed by the detailed discussion of the needs for and the applicability of distance learning. Then, an example is provided for the application of the Internet-based performance centered instructions (IPCI) model for providing Web-based DL experiments in the special field of surface mounting technology (SMT) for students of electrical engineering and graduate engineers interested in microelectronics packaging and interconnection technology. Finally conclusions are drawn and further efforts are outlined.