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In this presentation I will profile a course in electronic packaging that I have introduced in the spring semester, 2001, at Rutgers University, School of Electrical and Computer Engineering. This presentation will first present a brief overview of the whole course and its status and then highlight the audio recording process. The course is targeted to the general population of electrical engineering students and industry part time students. The proposed course presents the concepts of analyzing and electrically modeling the IC package and investigates the package effects on signal integrity. Since packaging contributes significantly to the cost to manufacture an integrated circuit, this course will be of interest to students intended for employment in the microelectronics industry. A joint funded (IEEE and the PRC of Georgia Tech) project began in September 2001. This project takes all of the course material and generates a series of computer based lecture notes that would be modular in format. This way other instructors could select and download portions of the modules. The modules would be made available on a CD-ROM. Each module unit would be designed to stand-alone so that the audience would be able to learn only one topic of their choice. The series of modules, if taken in sequence, would provide the audience with a complete course.
Electronic Components and Technology Conference, 2004. Proceedings. 54th (Volume:2 )
Date of Conference: 1-4 June 2004