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Design of CMOS voltage controlled oscillators using package inductor

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5 Author(s)
Tae-Je Cho ; System LSI, Samsung Electron. Co. Ltd., Yongin, South Korea ; Se-Yong Oh ; Yoon, S.-W. ; Laskar, J.
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This paper presents three different types of CMOS Voltage-Controlled-Oscillators (VCO) with the integration of embedded inductors in a multi-layer package. A high quality (Q) inductor, pertinent to creating an efficient VCO, is easily made with a thick wiring line in a multi-layer package, The embedded inductors are designed with two different packaging technologies. One is a Fine Pitch Ball Grid Array Packaging (FBGA) technology and the other is a Wafer Level Packaging (WLP) technology. The FBGA inductor showed a Q-factor about 60 at the frequency of 2GHz and that of a WLP inductor was about 25 while at 2GHz. The performances of VCOs using embedded inductors were compared with the control, a VCO designed with conventional on-chip inductors. The use of FBGA and WLP created numerous advantages. The Total Figure-Of-Merit (FOM) was enhanced due to not only reduced phase-noises, but also to improved efficiency and tuning range.

Published in:

Electronic Components and Technology Conference, 2004. Proceedings. 54th  (Volume:2 )

Date of Conference:

1-4 June 2004