By Topic

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Lau, J.H. ; Agilent Technol. Inc., Santa Clara, CA, USA ; Dongkai Shangguan ; Lau, D.C.Y. ; Kung, T.T.W.
more authors

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn3.9-4.0wt%Ag0.5-0.6wt%Cu is proposed in this investigation. The test vehicle consists of a lead-free solder-bumped WLCSP, lead-free PCB, and lead-free solder paste. The coefficients of the fatigue equation presented herein are determined by best fitted with the isothermal fatigue data of the test vehicle. Failure modes and locations of the failed samples are discussed.

Published in:

Electronic Components and Technology Conference, 2004. Proceedings. 54th  (Volume:2 )

Date of Conference:

1-4 June 2004